Descrição
Key Features Up to 1.25Gbps bi-directional data links Hot-pluggable SFP footprint Extended cased temperature range(0°C to +70 °C) Fully metallic enclosure for low EMI Low power dissipation (1.05 W typical) Compact RJ-45 connector assembly Access to physical layer IC via 2-wire serial bus 1000 BASE-T operation in host systems with SERDES interface